Why Choose Gpilot

Zhejiang Gpilot Technology Co., Ltd

Zhejiang Gpilot Technology Co., Ltd.was established in 2009. As a high and new technology enterprise, we develop, manufacture and supply bonding wires made of gold, copper and silver. 13 years research and sales in the field, now we have a experienced technical team, obtains 13 patents and 1 patent in application.Based on the field of packaging materials for semiconductor, our main products are gold bonding wires, special (Au+Ag) bonding wires, silver alloy bonding wires, copper bonding wires and silver bonding wires.
 
Zhejiang Gpilot Technology Co., Ltd. was established in 2009. As a high and new technology enterprise, we develop, manufacture and supply bonding wires made of gold, copper and silver.
Based on the field of packaging materials for semiconductor, our main products are gold bonding wires, special (Au+Ag) bonding wires, silver alloy bonding wires, copper bonding wires and silver bonding wires. 
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